Etch, ALD & Deposition
PlasPro Estrelas 100 Deep Silicon Etching System 
The PlasmaPro Estrelas100 deep silicon etchtechnology from Oxford Instruments delivers industry leading process performance.
- Developed with the R&D market in mind, thePlasmaPro Estrelas100 offers the ultimate in process flexibility. Nano and micro structures can be realised as the hardware has been designed with the ability to run Bosch™ andCryo etch technologies in the same chamber.
- From smooth sidewall processes to high etch rate cavity etches, the PlasmaProEstrelas100 has been designed to ensure that the wide range of MEMS applications can be realised without the need to change the chamber hardware.
The FlexAL® systems provide a new range of flexibility and capability in the engineering of nanoscale structures and devices by offering remote plasma atomic layer deposition (ALD) processes and thermal ALD within a single ALD system.
Maximum flexibility in the choice of materials and precursors
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Low-temperature processes enabled by plasma ALD
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Low damage maintained by the use of remote plasma
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Controllable, repeatable processes via recipe-driven software interface
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Can be configured for both R&D and Production environments
PlasPro System 133 Plasma Etch and Deposition Tool 
The PlasmaPro System133 tool has up to 300mm single wafer and large batch capability, offering excellent uniformity and high throughput on a range of applications and exceptional performance for both production and research & development.
- Up to 300mm single wafer or cassette load
- Industry-leading multi-wafer batch processing for 2", 3" and 4" including cassette loading of batch carrier plates
- Wide temperature range substrate electrodes: -120°C to 400°C