3. Chemical Mechanical Planarization

 

   
METRYX Tools for characterizing a wafer’s mass with atomic precision done non-destructively and non-intrusively and can highlight process problems quicker than any other form of metrology.
   
SPM: CMP polisher carrier rings and force transfer buttons (PPS, Delrin, Ceramic and other materials)
   
ProSys manufacturers sub-micron contamination-sensitive products, ProSys' MegaSonics Cleaners provides superior cleaning performance, substantially higher reliability.
   
Axus Technology: provides advanced state-of-the-art equipment and process solutions for surface processing applications, including polishing, grinding and lapping.

   

Tamar Technology: Precision metrology systems such as Optical Profilometer, Wafer Thickness, Vision Metrology, & Defect Detection